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Effect of aging temperature on the intermetallic compound (IMC) formation of Sn-0.7Cu/Si3N4 composite solder

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Main Authors: Mohd Arif Anuar, Mohd Salleh, Noraniza, Saud, S.I. Najib
Other Authors: arifanuar@unimap.edu.my
Format: Article
Language:English
Published: Trans Tech Publications 2014
Subjects:
Aging
Composite
Intermetallic
Online Access:http://dspace.unimap.edu.my:80/dspace/handle/123456789/34873
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spelling my.unimap-348732014-05-29T08:27:28Z Effect of aging temperature on the intermetallic compound (IMC) formation of Sn-0.7Cu/Si3N4 composite solder Mohd Arif Anuar, Mohd Salleh Noraniza, Saud S.I. Najib arifanuar@unimap.edu.my Aging Composite Intermetallic Link to publisher's homepage at http://www.scientific.net/ Nowadays, excessive growth intermetallic formation becomes the major issue in electronic packaging industry. The investigation on the effect of aging temperature to the intermetallic compound (IMCs) growth formation for Sn-0.7Cu/1.0-Si3N4 was studied. Isothermal aging process was carried out for 24 hours, with 5 difference aging temperature from 50°C up to 150°C. It is found that the Cu-Sn IMCs which appear after reflowed process, has grew rapidly when aging temperature was increased up to 125°C and started to reduced after 150°C aging temperature. 2014-05-29T08:19:50Z 2014-05-29T08:19:50Z 2013 Article Advanced Materials Research, vol.795, 2013, pages 522-525 1662-8985 http://www.scientific.net/AMR.795.522 http://dspace.unimap.edu.my:80/dspace/handle/123456789/34873 10.4028/www.scientific.net/AMR.795.522 en Trans Tech Publications
institution Universiti Malaysia Perlis
building UniMAP Library
collection Institutional Repository
continent Asia
country Malaysia
content_provider Universiti Malaysia Perlis
content_source UniMAP Library Digital Repository
url_provider http://dspace.unimap.edu.my/
language English
topic Aging
Composite
Intermetallic
spellingShingle Aging
Composite
Intermetallic
Mohd Arif Anuar, Mohd Salleh
Noraniza, Saud
S.I. Najib
Effect of aging temperature on the intermetallic compound (IMC) formation of Sn-0.7Cu/Si3N4 composite solder
description Link to publisher's homepage at http://www.scientific.net/
author2 arifanuar@unimap.edu.my
author_facet arifanuar@unimap.edu.my
Mohd Arif Anuar, Mohd Salleh
Noraniza, Saud
S.I. Najib
format Article
author Mohd Arif Anuar, Mohd Salleh
Noraniza, Saud
S.I. Najib
author_sort Mohd Arif Anuar, Mohd Salleh
title Effect of aging temperature on the intermetallic compound (IMC) formation of Sn-0.7Cu/Si3N4 composite solder
title_short Effect of aging temperature on the intermetallic compound (IMC) formation of Sn-0.7Cu/Si3N4 composite solder
title_full Effect of aging temperature on the intermetallic compound (IMC) formation of Sn-0.7Cu/Si3N4 composite solder
title_fullStr Effect of aging temperature on the intermetallic compound (IMC) formation of Sn-0.7Cu/Si3N4 composite solder
title_full_unstemmed Effect of aging temperature on the intermetallic compound (IMC) formation of Sn-0.7Cu/Si3N4 composite solder
title_sort effect of aging temperature on the intermetallic compound (imc) formation of sn-0.7cu/si3n4 composite solder
publisher Trans Tech Publications
publishDate 2014
url http://dspace.unimap.edu.my:80/dspace/handle/123456789/34873
_version_ 1643797641248636928
score 13.214268

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