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Thermal management of electronic components by using computational fluid dynamic (CFD) software, fluent™ in several material applications (epoxy, composite material & nano-silver)

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Main Authors: Mazlan, Mohamed, A. Rahim, Mohd Mustafa Al-Bakri, Abdullah, Wan Yusra Hannanah, Wan Abdul Razak, Ahmad Faiz, Zubair, Y. M., Najib, A. Bakir, Azman
Other Authors: mazlan547@ppinang.uitm.edu.my
Format: Article
Language:English
Published: Trans Tech Publications 2014
Subjects:
Average junction temperature
Microprocessors
Nanomaterial
Thermal Management
Online Access:http://dspace.unimap.edu.my:80/dspace/handle/123456789/34343
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spelling my.unimap-343432014-05-06T05:20:18Z Thermal management of electronic components by using computational fluid dynamic (CFD) software, fluent™ in several material applications (epoxy, composite material & nano-silver) Mazlan, Mohamed A. Rahim Mohd Mustafa Al-Bakri, Abdullah Wan Yusra Hannanah, Wan Abdul Razak Ahmad Faiz, Zubair Y. M., Najib A. Bakir, Azman mazlan547@ppinang.uitm.edu.my mustafa_albakri@unimap.edu.my Average junction temperature Microprocessors Nanomaterial Thermal Management Link to publisher's homepage at http://www.ttp.net/ This paper presents the thermal management of electronic components, microprocessor by using three dimensional numerical analysis of heat and fluid flow in computer. 3D model of microprocessors is built using GAMBIT and simulated using FLUENT software. The study was made for four microprocessors arranged in line under different types of materials, inlet velocities and package (chip) powers. The results are presented in terms of averagejunction temperature and thermal resistance of each package Thejunction temperature is been observed and it was found that the junction temperature of the microprocessors is not exceed 70° C. It also found that the (chip) powers and inlet velocities are the most important elements to control and manage the junction temperature. The strength of CFD software in handling heat transfer problems is proved to be excellent 2014-05-06T05:20:18Z 2014-05-06T05:20:18Z 2013 Article Advanced Materials Research, vol. 795, 2013, pages 141-147 978-303785811-0 1022-6680 http://www.scientific.net/AMR.795.141 http://dspace.unimap.edu.my:80/dspace/handle/123456789/34343 en Trans Tech Publications
institution Universiti Malaysia Perlis
building UniMAP Library
collection Institutional Repository
continent Asia
country Malaysia
content_provider Universiti Malaysia Perlis
content_source UniMAP Library Digital Repository
url_provider http://dspace.unimap.edu.my/
language English
topic Average junction temperature
Microprocessors
Nanomaterial
Thermal Management
spellingShingle Average junction temperature
Microprocessors
Nanomaterial
Thermal Management
Mazlan, Mohamed
A. Rahim
Mohd Mustafa Al-Bakri, Abdullah
Wan Yusra Hannanah, Wan Abdul Razak
Ahmad Faiz, Zubair
Y. M., Najib
A. Bakir, Azman
Thermal management of electronic components by using computational fluid dynamic (CFD) software, fluent™ in several material applications (epoxy, composite material & nano-silver)
description Link to publisher's homepage at http://www.ttp.net/
author2 mazlan547@ppinang.uitm.edu.my
author_facet mazlan547@ppinang.uitm.edu.my
Mazlan, Mohamed
A. Rahim
Mohd Mustafa Al-Bakri, Abdullah
Wan Yusra Hannanah, Wan Abdul Razak
Ahmad Faiz, Zubair
Y. M., Najib
A. Bakir, Azman
format Article
author Mazlan, Mohamed
A. Rahim
Mohd Mustafa Al-Bakri, Abdullah
Wan Yusra Hannanah, Wan Abdul Razak
Ahmad Faiz, Zubair
Y. M., Najib
A. Bakir, Azman
author_sort Mazlan, Mohamed
title Thermal management of electronic components by using computational fluid dynamic (CFD) software, fluent™ in several material applications (epoxy, composite material & nano-silver)
title_short Thermal management of electronic components by using computational fluid dynamic (CFD) software, fluent™ in several material applications (epoxy, composite material & nano-silver)
title_full Thermal management of electronic components by using computational fluid dynamic (CFD) software, fluent™ in several material applications (epoxy, composite material & nano-silver)
title_fullStr Thermal management of electronic components by using computational fluid dynamic (CFD) software, fluent™ in several material applications (epoxy, composite material & nano-silver)
title_full_unstemmed Thermal management of electronic components by using computational fluid dynamic (CFD) software, fluent™ in several material applications (epoxy, composite material & nano-silver)
title_sort thermal management of electronic components by using computational fluid dynamic (cfd) software, fluent™ in several material applications (epoxy, composite material & nano-silver)
publisher Trans Tech Publications
publishDate 2014
url http://dspace.unimap.edu.my:80/dspace/handle/123456789/34343
_version_ 1643797452686360576
score 13.214268

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