Description: Thermal management of electronic components by using computational fluid dynamic (CFD) software, fluent™ in several material applications (epoxy, composite material & nano-silver)

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Bibliographic Details
Main Authors:	Mazlan, Mohamed, A. Rahim, Mohd Mustafa Al-Bakri, Abdullah, Wan Yusra Hannanah, Wan Abdul Razak, Ahmad Faiz, Zubair, Y. M., Najib, A. Bakir, Azman
Other Authors:	mazlan547@ppinang.uitm.edu.my
Format:	Article
Language:	English
Published:	Trans Tech Publications 2014
Subjects:	Average junction temperature Microprocessors Nanomaterial Thermal Management
Online Access:	http://dspace.unimap.edu.my:80/dspace/handle/123456789/34343
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