A new invention of thermal pad using sol-gel nano-silver doped silica film in plastic leaded chip carrier (PLCC) application by using computational fluid dynamic sofrware, CFD analysis

• Main Authors: Mazlan, Mohamed, A. Rahim, Mohd Mustafa Al-Bakri, Abdullah, Iqbal, M. A., Wan Yusra Hannanah, Wan Abdul Razak, Mohammad Shahril, Salim
• Other Authors: [e-mail]
• Format: Article
• Language: English
• Published: Trans Tech Publications 2014
• Subjects: Nano-Silver; Numerical simulation; PLCC package; Thermal pad
• Online Access: http://dspace.unimap.edu.my:80/dspace/handle/123456789/34339

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