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A new invention of thermal pad using sol-gel nano-silver doped silica film in plastic leaded chip carrier (PLCC) application by using computational fluid dynamic sofrware, CFD analysis

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Main Authors: Mazlan, Mohamed, A. Rahim, Mohd Mustafa Al-Bakri, Abdullah, Iqbal, M. A., Wan Yusra Hannanah, Wan Abdul Razak, Mohammad Shahril, Salim
Other Authors: mazlan547@ppinang.uitm.edu.my
Format: Article
Language:English
Published: Trans Tech Publications 2014
Subjects:
Nano-Silver
Numerical simulation
PLCC package
Thermal pad
Online Access:http://dspace.unimap.edu.my:80/dspace/handle/123456789/34339
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spelling my.unimap-343392014-05-06T04:46:06Z A new invention of thermal pad using sol-gel nano-silver doped silica film in plastic leaded chip carrier (PLCC) application by using computational fluid dynamic sofrware, CFD analysis Mazlan, Mohamed A. Rahim Mohd Mustafa Al-Bakri, Abdullah Iqbal, M. A. Wan Yusra Hannanah, Wan Abdul Razak Mohammad Shahril, Salim mazlan547@ppinang.uitm.edu.my mustafa_albakri@unimap.edu.my mshahril@unimap.edu.my Nano-Silver Numerical simulation PLCC package Thermal pad Link to publisher's homepage at http://www.ttp.net/ Thermal pad is new technology in the world that been used in PLCC in order to reduce junction temperature to the minimum level in electronic components. Thermal Pad was made by using nano-silver as main material. Nano-silver silica films were applied on PLCC using a sol-gel process and heat-treated at different temperatures. In electronic industry, the electronic components that exceed 70°C will malfunction and damage due to the overheated. The design is used nano-silver as main material in thermo pad because it has high value of thermal conductivity and enables to dissipate heat very efficiently. The advantages of this product are enables to reduce junction temperature of PLCC 20-30%. It also had constant thickness in order to get accurate results. It was a new technology that been applied in electronic industry in order to reduce the temperature of the electronic components. 2014-05-06T04:46:06Z 2014-05-06T04:46:06Z 2013 Article Advanced Materials Research, vol. 795, 2013, pages 158-163 978-303785811-0 1022-6680 http://www.scientific.net/AMR.795.158 http://dspace.unimap.edu.my:80/dspace/handle/123456789/34339 en Trans Tech Publications
institution Universiti Malaysia Perlis
building UniMAP Library
collection Institutional Repository
continent Asia
country Malaysia
content_provider Universiti Malaysia Perlis
content_source UniMAP Library Digital Repository
url_provider http://dspace.unimap.edu.my/
language English
topic Nano-Silver
Numerical simulation
PLCC package
Thermal pad
spellingShingle Nano-Silver
Numerical simulation
PLCC package
Thermal pad
Mazlan, Mohamed
A. Rahim
Mohd Mustafa Al-Bakri, Abdullah
Iqbal, M. A.
Wan Yusra Hannanah, Wan Abdul Razak
Mohammad Shahril, Salim
A new invention of thermal pad using sol-gel nano-silver doped silica film in plastic leaded chip carrier (PLCC) application by using computational fluid dynamic sofrware, CFD analysis
description Link to publisher's homepage at http://www.ttp.net/
author2 mazlan547@ppinang.uitm.edu.my
author_facet mazlan547@ppinang.uitm.edu.my
Mazlan, Mohamed
A. Rahim
Mohd Mustafa Al-Bakri, Abdullah
Iqbal, M. A.
Wan Yusra Hannanah, Wan Abdul Razak
Mohammad Shahril, Salim
format Article
author Mazlan, Mohamed
A. Rahim
Mohd Mustafa Al-Bakri, Abdullah
Iqbal, M. A.
Wan Yusra Hannanah, Wan Abdul Razak
Mohammad Shahril, Salim
author_sort Mazlan, Mohamed
title A new invention of thermal pad using sol-gel nano-silver doped silica film in plastic leaded chip carrier (PLCC) application by using computational fluid dynamic sofrware, CFD analysis
title_short A new invention of thermal pad using sol-gel nano-silver doped silica film in plastic leaded chip carrier (PLCC) application by using computational fluid dynamic sofrware, CFD analysis
title_full A new invention of thermal pad using sol-gel nano-silver doped silica film in plastic leaded chip carrier (PLCC) application by using computational fluid dynamic sofrware, CFD analysis
title_fullStr A new invention of thermal pad using sol-gel nano-silver doped silica film in plastic leaded chip carrier (PLCC) application by using computational fluid dynamic sofrware, CFD analysis
title_full_unstemmed A new invention of thermal pad using sol-gel nano-silver doped silica film in plastic leaded chip carrier (PLCC) application by using computational fluid dynamic sofrware, CFD analysis
title_sort new invention of thermal pad using sol-gel nano-silver doped silica film in plastic leaded chip carrier (plcc) application by using computational fluid dynamic sofrware, cfd analysis
publisher Trans Tech Publications
publishDate 2014
url http://dspace.unimap.edu.my:80/dspace/handle/123456789/34339
_version_ 1643797451475255296
score 13.214268

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