Application of artificial intelligence for the determination of package parameters for a desired solder joint fatigue life

• Main Authors: Lee, Kor Oon, Ong, Kang E., Seetharamu, Kankanhally N., Ishak, Abdul Azid, Dr., Ghulam, Abdul Quadir, Prof. Dr., Goh, Teck Joo
• Other Authors: [e-mail]
• Format: Article
• Language: English
• Published: Emerald Group Publishing 2014
• Subjects: Joining materials; Reliability management; Solders
• Online Access: http://dspace.unimap.edu.my:80/dspace/handle/123456789/33853

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