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CuDia slug size variation analysis on heat dissipation of high power LED

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Main Authors: Vairavan, Rajendaran, Retnasamy, Vithyacharan, Zaliman, Sauli, Dr.
Other Authors: vc.sundress@gmail.com
Format: Article
Language:English
Published: Trans Tech Publications 2014
Subjects:
Ansys
CuDia heat slug
High power LED
Junction temperature
Online Access:http://dspace.unimap.edu.my:80/dspace/handle/123456789/33665
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spelling my.unimap-336652014-04-13T08:03:29Z CuDia slug size variation analysis on heat dissipation of high power LED Vairavan, Rajendaran Retnasamy, Vithyacharan Zaliman, Sauli, Dr. vc.sundress@gmail.com Ansys CuDia heat slug High power LED Junction temperature Link to publisher's homepage at http://www.ttp.net/ The current advancement of LED has prompt thermal challenges from the packaging point of view. The reliability of the LED is significantly influenced by each of its packaging component. This paper presents the investigation of heat slug size effect on the junction temperature and stress of single chip LED through simulation method. Ansys version 11 was utilized and the analysis was done with copper diamond rectangular heat slug under natural convection condition at ambient temperature of 25 °C.The simulation results indicated that junction temperature and the stress of the single chip LED is influenced by the size of heat slug. 2014-04-13T08:03:29Z 2014-04-13T08:03:29Z 2014-01 Article Applied Mechanics and Materials, vol.487, 2014, pages 33-36 1662-7482 http://dspace.unimap.edu.my:80/dspace/handle/123456789/33665 http://www.scientific.net/AMM.487.33 10.4028/www.scientific.net/AMM.487.33 en Trans Tech Publications
institution Universiti Malaysia Perlis
building UniMAP Library
collection Institutional Repository
continent Asia
country Malaysia
content_provider Universiti Malaysia Perlis
content_source UniMAP Library Digital Repository
url_provider http://dspace.unimap.edu.my/
language English
topic Ansys
CuDia heat slug
High power LED
Junction temperature
spellingShingle Ansys
CuDia heat slug
High power LED
Junction temperature
Vairavan, Rajendaran
Retnasamy, Vithyacharan
Zaliman, Sauli, Dr.
CuDia slug size variation analysis on heat dissipation of high power LED
description Link to publisher's homepage at http://www.ttp.net/
author2 vc.sundress@gmail.com
author_facet vc.sundress@gmail.com
Vairavan, Rajendaran
Retnasamy, Vithyacharan
Zaliman, Sauli, Dr.
format Article
author Vairavan, Rajendaran
Retnasamy, Vithyacharan
Zaliman, Sauli, Dr.
author_sort Vairavan, Rajendaran
title CuDia slug size variation analysis on heat dissipation of high power LED
title_short CuDia slug size variation analysis on heat dissipation of high power LED
title_full CuDia slug size variation analysis on heat dissipation of high power LED
title_fullStr CuDia slug size variation analysis on heat dissipation of high power LED
title_full_unstemmed CuDia slug size variation analysis on heat dissipation of high power LED
title_sort cudia slug size variation analysis on heat dissipation of high power led
publisher Trans Tech Publications
publishDate 2014
url http://dspace.unimap.edu.my:80/dspace/handle/123456789/33665
_version_ 1643797246048731136
score 13.214268

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