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Heat sink fin number variation analysis on single chip high power LED

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Main Authors: Zaliman, Sauli, Dr., Vairavan, Rajendaran, Retnasamy, Vithyacharan
Other Authors: zaliman@unimap.edu.my
Format: Article
Language:English
Published: Trans Tech Publications 2014
Subjects:
Ansys
Heat sink fin number
High power LED
Junction temperature
Von mises stress
Online Access:http://dspace.unimap.edu.my:80/dspace/handle/123456789/33664
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spelling my.unimap-336642014-04-13T07:48:55Z Heat sink fin number variation analysis on single chip high power LED Zaliman, Sauli, Dr. Vairavan, Rajendaran Retnasamy, Vithyacharan zaliman@unimap.edu.my Ansys Heat sink fin number High power LED Junction temperature Von mises stress Link to publisher's homepage at http://www.ttp.net/ Thermal management of high power LED is crucial the reliability and performance of the LED affected by the heat produced during photon emission. Heat sinks are utilized to dissipate the heat and to lower the operating junction temperature of LED. This paper demonstrates a simulation work done to evaluate the influence heat sink fin number on the junction temperature and stress of single chip LED package using Ansys version 11. The heat sink with fin number of 4 fins, 6 fins and 8 fins were used and compared. Results showed that increase in heat sink fin number significantly reduces the junction temperature of the LED package. 2014-04-13T07:48:55Z 2014-04-13T07:48:55Z 2014-01 Article Applied Mechanics and Materials, vol.487, 2014, pages 149-152 1662-7482 http://dspace.unimap.edu.my:80/dspace/handle/123456789/33664 http://www.scientific.net/AMM.487.149 10.4028/www.scientific.net/AMM.487.149 en Trans Tech Publications
institution Universiti Malaysia Perlis
building UniMAP Library
collection Institutional Repository
continent Asia
country Malaysia
content_provider Universiti Malaysia Perlis
content_source UniMAP Library Digital Repository
url_provider http://dspace.unimap.edu.my/
language English
topic Ansys
Heat sink fin number
High power LED
Junction temperature
Von mises stress
spellingShingle Ansys
Heat sink fin number
High power LED
Junction temperature
Von mises stress
Zaliman, Sauli, Dr.
Vairavan, Rajendaran
Retnasamy, Vithyacharan
Heat sink fin number variation analysis on single chip high power LED
description Link to publisher's homepage at http://www.ttp.net/
author2 zaliman@unimap.edu.my
author_facet zaliman@unimap.edu.my
Zaliman, Sauli, Dr.
Vairavan, Rajendaran
Retnasamy, Vithyacharan
format Article
author Zaliman, Sauli, Dr.
Vairavan, Rajendaran
Retnasamy, Vithyacharan
author_sort Zaliman, Sauli, Dr.
title Heat sink fin number variation analysis on single chip high power LED
title_short Heat sink fin number variation analysis on single chip high power LED
title_full Heat sink fin number variation analysis on single chip high power LED
title_fullStr Heat sink fin number variation analysis on single chip high power LED
title_full_unstemmed Heat sink fin number variation analysis on single chip high power LED
title_sort heat sink fin number variation analysis on single chip high power led
publisher Trans Tech Publications
publishDate 2014
url http://dspace.unimap.edu.my:80/dspace/handle/123456789/33664
_version_ 1643797245753032704
score 13.222552

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