Synthesis and characterization of electroless copper coated SiC particles

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Main Authors: Azmi, Kamardin, Mohd Arif Anuar, Mohd Salleh, Mohd Nazree, Derman, Dr.
Other Authors: azmikamardin@unimap.edu.my
Format: Article
Language:English
Published: Trans Tech Publications 2014
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Online Access:http://dspace.unimap.edu.my:80/dspace/handle/123456789/32813
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spelling my.unimap-328132014-03-18T03:36:20Z Synthesis and characterization of electroless copper coated SiC particles Azmi, Kamardin Mohd Arif Anuar, Mohd Salleh Mohd Nazree, Derman, Dr. azmikamardin@unimap.edu.my arifanuar@unimap.edu.my nazree@unimap.edu.my Advanced packaging materials Electroless copper Silicon carbide Link to publisher's homepage at http://www.ttp.net/ Silicon carbide reinforced copper matrix (Cu-SiCp) composites fabricated via the conventional powder metallurgy methods have inferior thermophysical properties due to the weak bonding between the copper matrix and the SiCp reinforcement. In order to improve the bonding between the two constituents, the SiCp were copper coated via electroless coating process. Based on the experimental results and findings, a continuous copper deposition on the SiCp was obtained via the electroless plating process. The copper film was found to be high in purity and homogeneously deposited on the SiCp surfaces. The thickness of the coated copper layer was roughly estimated to be around 1μm. 2014-03-18T03:36:20Z 2014-03-18T03:36:20Z 2013 Article Advanced Materials Research, vol. 795, 2013, pages 233-236 978-303785811-0 1022-6680 http://www.scientific.net/AMR.795.233 http://dspace.unimap.edu.my:80/dspace/handle/123456789/32813 en Trans Tech Publications
institution Universiti Malaysia Perlis
building UniMAP Library
collection Institutional Repository
continent Asia
country Malaysia
content_provider Universiti Malaysia Perlis
content_source UniMAP Library Digital Repository
url_provider http://dspace.unimap.edu.my/
language English
topic Advanced packaging materials
Electroless copper
Silicon carbide
spellingShingle Advanced packaging materials
Electroless copper
Silicon carbide
Azmi, Kamardin
Mohd Arif Anuar, Mohd Salleh
Mohd Nazree, Derman, Dr.
Synthesis and characterization of electroless copper coated SiC particles
description Link to publisher's homepage at http://www.ttp.net/
author2 azmikamardin@unimap.edu.my
author_facet azmikamardin@unimap.edu.my
Azmi, Kamardin
Mohd Arif Anuar, Mohd Salleh
Mohd Nazree, Derman, Dr.
format Article
author Azmi, Kamardin
Mohd Arif Anuar, Mohd Salleh
Mohd Nazree, Derman, Dr.
author_sort Azmi, Kamardin
title Synthesis and characterization of electroless copper coated SiC particles
title_short Synthesis and characterization of electroless copper coated SiC particles
title_full Synthesis and characterization of electroless copper coated SiC particles
title_fullStr Synthesis and characterization of electroless copper coated SiC particles
title_full_unstemmed Synthesis and characterization of electroless copper coated SiC particles
title_sort synthesis and characterization of electroless copper coated sic particles
publisher Trans Tech Publications
publishDate 2014
url http://dspace.unimap.edu.my:80/dspace/handle/123456789/32813
_version_ 1643796994999713792
score 13.209306