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Wire bond shear test simulation on sharp groove surface bond pad

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Bibliographic Details
Main Authors: Zaliman, Sauli, Dr., Retnasamy, Vithyacharan, Taniselass, Steven, Ahmad Husni, Mohd Shapri, Vairavan, Rajendaran
Other Authors: vc.sundress@gmail.com
Format: Article
Language:English
Published: Trans Tech Publications 2014
Subjects:
ANSYS
Sharp groove surface
Shear test
Wire bond
Online Access:http://dspace.unimap.edu.my:80/dspace/handle/123456789/32661
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spelling my.unimap-326612014-03-13T04:12:15Z Wire bond shear test simulation on sharp groove surface bond pad Zaliman, Sauli, Dr. Retnasamy, Vithyacharan Taniselass, Steven Ahmad Husni, Mohd Shapri Vairavan, Rajendaran vc.sundress@gmail.com ANSYS Sharp groove surface Shear test Wire bond Link to publisher's homepage at http://www.ttp.net/ Wire bonding process is first level interconnection technology used in the semiconductor packaging industry. The wire bond shear tests are used in the industry to examine the bond strength and reliability of the bonded wires. Hence, in this study thesimulation on wire bond shear test is performed on a sharp groove surface bond pad. ANSYS ver 11 was used to perform the simulation. The stress response of the bonded wires are investigated.The effects of three wire materials gold(Au), aluminum(Al) and copper(Cu) on the stress response during shear test were examined. The simulation results showed that copper wire bond induces highest stress and gold wire exhibits the least stress response. 2014-03-13T04:12:15Z 2014-03-13T04:12:15Z 2012-12 Article Advanced Materials Research, vol.262-623, 2012, pages 647-651 1662-8985 http://dspace.unimap.edu.my:80/dspace/handle/123456789/32661 http://www.scientific.net/AMR.622-623.647 en Trans Tech Publications
institution Universiti Malaysia Perlis
building UniMAP Library
collection Institutional Repository
continent Asia
country Malaysia
content_provider Universiti Malaysia Perlis
content_source UniMAP Library Digital Repository
url_provider http://dspace.unimap.edu.my/
language English
topic ANSYS
Sharp groove surface
Shear test
Wire bond
spellingShingle ANSYS
Sharp groove surface
Shear test
Wire bond
Zaliman, Sauli, Dr.
Retnasamy, Vithyacharan
Taniselass, Steven
Ahmad Husni, Mohd Shapri
Vairavan, Rajendaran
Wire bond shear test simulation on sharp groove surface bond pad
description Link to publisher's homepage at http://www.ttp.net/
author2 vc.sundress@gmail.com
author_facet vc.sundress@gmail.com
Zaliman, Sauli, Dr.
Retnasamy, Vithyacharan
Taniselass, Steven
Ahmad Husni, Mohd Shapri
Vairavan, Rajendaran
format Article
author Zaliman, Sauli, Dr.
Retnasamy, Vithyacharan
Taniselass, Steven
Ahmad Husni, Mohd Shapri
Vairavan, Rajendaran
author_sort Zaliman, Sauli, Dr.
title Wire bond shear test simulation on sharp groove surface bond pad
title_short Wire bond shear test simulation on sharp groove surface bond pad
title_full Wire bond shear test simulation on sharp groove surface bond pad
title_fullStr Wire bond shear test simulation on sharp groove surface bond pad
title_full_unstemmed Wire bond shear test simulation on sharp groove surface bond pad
title_sort wire bond shear test simulation on sharp groove surface bond pad
publisher Trans Tech Publications
publishDate 2014
url http://dspace.unimap.edu.my:80/dspace/handle/123456789/32661
_version_ 1643796945500635136
score 13.214268

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