Microstructure evolution of Sn-3.5Ag-1.0Cu-0.5Ni/Cu system lead free solder under long term thermal aging

• Main Authors: Noor Asikin, Ab Ghani, Iziana, Yahya, Mohd Arif Anuar, Mohd Salleh, Saidatulakmar, Shamsuddin, Zainal Arifin, Ahmad, Ramani, Mayappan
• 其他作者: [e-mail]
• 格式: Article
• 语言: English
• 出版: Scientific.Net 2014
• 主题: Intermetallic; Powder metallurgy; Scanning electron microscope (SEM); Sn-Ag-Cu-Ni; Thermal aging
• 在线阅读: http://dspace.unimap.edu.my:80/dspace/handle/123456789/32124

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