Research development of solder materials and its intermetallic compound (IMC) study

• Main Authors: Mohd Arif Anuar, Mohd Salleh, Najib S., Ibrahim, Saud, N., Mohd Mustafa Al Bakri, Abdullah, Nik Noriman, Zulkepli, Ramani, Mayapan, Zainal Ariffin, Ahmad
• 其他作者: [e-mail]
• 格式: Article
• 語言: English
• 出版: Scientific.Net/Trans Tech Publications 2014
• 主題: Composite; Intermetallic compound; Lead-Free solder; Solder fabrication
• 在線閱讀: http://dspace.unimap.edu.my:80/dspace/handle/123456789/32033

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