持有资料: Research development of solder materials and its intermetallic compound (IMC) study

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Main Authors:	Mohd Arif Anuar, Mohd Salleh, Najib S., Ibrahim, Saud, N., Mohd Mustafa Al Bakri, Abdullah, Nik Noriman, Zulkepli, Ramani, Mayapan, Zainal Ariffin, Ahmad
其他作者:	arifanuar@unimap.edu.my
格式:	Article
语言:	English
出版:	Scientific.Net/Trans Tech Publications 2014
主题:	Composite Intermetallic compound Lead-Free solder Solder fabrication
在线阅读:	http://dspace.unimap.edu.my:80/dspace/handle/123456789/32033
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