Surfactant-free synthesis of copper particles for electrically conductive adhesive applications
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my.unimap-265682013-07-10T08:45:40Z Surfactant-free synthesis of copper particles for electrically conductive adhesive applications Ho, Li Ngee Nishikawa, Hiroshi holingee@yahoo.com Conductive adhesive Copper Electrical resistivity Synthesis Link to publisher's homepage at http://www.tms.org/ In this study, a simple one-step microwave-assisted method was developed to synthesize Cu and Cu-Ag particles for application in electrically conductive adhesive (ECA). The particle size of the obtained Cu particles was about 1 μm to 3 μm, whereas Cu-Ag particles were in the range of 0.1 μm to 1.0 μm. ECA samples were cured at 175°C for 1 h. Results revealed that the as-cured ECAs showed significant differences in electrical resistivity. The resistivity of Cu-filled ECA was on the order of 10 -5 Ω cm, which was lower than the Cu-Ag-filled ECAs with resistivity on the order of 10 -3 Ω cm. The thermal stability of the ECAs was studied under high-temperature exposure at 125°C for 1000 h. Results showed that Cu-filled ECA was thermally stable for 1000 h of aging, whereas Cu-Ag-filled ECAs were thermally stable for aging time above 100 h 2013-07-10T08:45:40Z 2013-07-10T08:45:40Z 2012-09 Article Journal of Electronic Materials, 2012, vol. 41(9), pages 2527-2532 0361-5235 http://link.springer.com/article/10.1007%2Fs11664-012-2102-x http://hdl.handle.net/123456789/26568 en TMS |
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Conductive adhesive Copper Electrical resistivity Synthesis |
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Conductive adhesive Copper Electrical resistivity Synthesis Ho, Li Ngee Nishikawa, Hiroshi Surfactant-free synthesis of copper particles for electrically conductive adhesive applications |
| description |
Link to publisher's homepage at http://www.tms.org/ |
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holingee@yahoo.com |
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holingee@yahoo.com Ho, Li Ngee Nishikawa, Hiroshi |
| format |
Article |
| author |
Ho, Li Ngee Nishikawa, Hiroshi |
| author_sort |
Ho, Li Ngee |
| title |
Surfactant-free synthesis of copper particles for electrically conductive adhesive applications |
| title_short |
Surfactant-free synthesis of copper particles for electrically conductive adhesive applications |
| title_full |
Surfactant-free synthesis of copper particles for electrically conductive adhesive applications |
| title_fullStr |
Surfactant-free synthesis of copper particles for electrically conductive adhesive applications |
| title_full_unstemmed |
Surfactant-free synthesis of copper particles for electrically conductive adhesive applications |
| title_sort |
surfactant-free synthesis of copper particles for electrically conductive adhesive applications |
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TMS |
| publishDate |
2013 |
| url |
http://dspace.unimap.edu.my/xmlui/handle/123456789/26568 |
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1643794989447118848 |
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13.214268 |