Temperature oriented design of an amplifier using submicron VLSI
International Conference on Man Machine Systems (ICoMMS 2012) organized by School of Mechatronic Engineering, co-organized by The Institute of Engineer, Malaysia (IEM) and Society of Engineering Education Malaysia, 27th - 28th February 2012 at Bayview Beach Resort, Penang, Malaysia.
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Universiti Malaysia Perlis (UniMAP)
2012
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my.unimap-207132012-08-15T08:46:48Z Temperature oriented design of an amplifier using submicron VLSI Rukkumani, V. Devarajan, N., Prof. Dr. Rukkumani_129@rediffmail.com Profdevarajan@yahoo.com Deep submicron technology Microwind Processing element Nanoscale technology Power consumption International Conference on Man Machine Systems (ICoMMS 2012) organized by School of Mechatronic Engineering, co-organized by The Institute of Engineer, Malaysia (IEM) and Society of Engineering Education Malaysia, 27th - 28th February 2012 at Bayview Beach Resort, Penang, Malaysia. In recent trends various steps like logic optimization partitioning, floorplanning, placement and routing are used for design of any VLSI circuits. Among the above steps floor planning and placement play an important role in integrated circuit design. A set of components in a circuit which are called as modules or blocks are connected through interconnections called as ‘wires’. Floorplanning and placement is used to reduce the total area, size, power, temperature and cost of any circuit design. Various computational techniques are used to calculate and minimize the above parameters. Single IC consists of various Processing Elements (PE’s), which works on various voltage ranges. Due to this the IC power consumption increases, thereby temperature of the chip also increases. The main goal of this paper is to focus on calculation of area and power of any complicated VLSI circuit and to show Microwind simulation output for future design of any complicated circuits for various temperature ranges. The Submicron Technology is widely used for design of any analog circuits in Microwind. 2012-08-15T08:46:48Z 2012-08-15T08:46:48Z 2012-02-27 Working Paper http://hdl.handle.net/123456789/20713 en Proceedings of the International Conference on Man-Machine Systems (ICoMMS 2012) Universiti Malaysia Perlis (UniMAP) School of Mechatronic Engineering |
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Deep submicron technology Microwind Processing element Nanoscale technology Power consumption |
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Deep submicron technology Microwind Processing element Nanoscale technology Power consumption Rukkumani, V. Devarajan, N., Prof. Dr. Temperature oriented design of an amplifier using submicron VLSI |
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International Conference on Man Machine Systems (ICoMMS 2012) organized by School of Mechatronic Engineering, co-organized by The Institute of Engineer, Malaysia (IEM) and Society of Engineering Education Malaysia, 27th - 28th February 2012 at Bayview Beach Resort, Penang, Malaysia. |
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Rukkumani_129@rediffmail.com |
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Rukkumani_129@rediffmail.com Rukkumani, V. Devarajan, N., Prof. Dr. |
format |
Working Paper |
author |
Rukkumani, V. Devarajan, N., Prof. Dr. |
author_sort |
Rukkumani, V. |
title |
Temperature oriented design of an amplifier using submicron VLSI |
title_short |
Temperature oriented design of an amplifier using submicron VLSI |
title_full |
Temperature oriented design of an amplifier using submicron VLSI |
title_fullStr |
Temperature oriented design of an amplifier using submicron VLSI |
title_full_unstemmed |
Temperature oriented design of an amplifier using submicron VLSI |
title_sort |
temperature oriented design of an amplifier using submicron vlsi |
publisher |
Universiti Malaysia Perlis (UniMAP) |
publishDate |
2012 |
url |
http://dspace.unimap.edu.my/xmlui/handle/123456789/20713 |
_version_ |
1643793159238451200 |
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13.211869 |