Wettability, electrical and mechanical properties of 99.3Sn-0.7Cu/Si 3N4 novel lead-free nanocomposite solder
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Trans Tech Publications
2011
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my.unimap-162932011-11-24T02:47:04Z Wettability, electrical and mechanical properties of 99.3Sn-0.7Cu/Si 3N4 novel lead-free nanocomposite solder Kamarudin, Hussin, Brig. Jen. Dato' Prof. Dr. Khairel Rafezi, Ahmad, Dr. Mohd Arif Anuar, Mohd Salleh Muhammad Hafiz, Hazizi Zainal Arifin, Ahmad, Prof. Dr. arifanuar@unimap.edu.my hafizhazizi@unimap.edu.my Composite Electrical properties Lead-free solder Mechanical properties Wettability Link to publisher's homepage at www.ttp.net/ A nanocomposite solder alloy with 99.3Sn-0.7Cu base alloy was successfully fabricated using the powder metallurgy route which consists of blending, compaction and sintering. Varying amount of nano size silicon nitride particulates were introduced as reinforcements to obtain a novel lead-free nanocomposite solder alloy. Following fabrication, the sintered nanocomposite solder were cut into thin solder disc and were analyzed in terms of their wettability, electrical and mechanical properties. Wettability, electrical and mechanical properties of the nanocomposite solder were compared to 99.3Sn-0.7Cu and 96.3Sn-3.0Ag-0.5Cu lead-free solder which were fabricated with the same method using powder metallurgy route. Wettability property of the nanocomposite solder was found to be in the accepted range with wettability angle below 45° similar to 99.3Sn-0.7Cu and 96.3Sn-3.0Ag-0.5Cu lead-free solder. Besides wettability, the results of electrical and mechanical properties analysis showed that additions of nano size Si3N4 had enhanced the strength and electrical conductivity of nanocomposite solder comparing to 99.3Sn- 0.7Cu and 96.3Sn-3.0Ag-0.5Cu lead-free solder. 2011-11-24T02:47:04Z 2011-11-24T02:47:04Z 2011-07-04 Article Advanced Materials Research , vol 277, 2011, pages 106-111 978-303785179-1 1022-6680 http://www.scientific.net/AMR.277.106 http://hdl.handle.net/123456789/16293 en Trans Tech Publications |
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English |
| topic |
Composite Electrical properties Lead-free solder Mechanical properties Wettability |
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Composite Electrical properties Lead-free solder Mechanical properties Wettability Kamarudin, Hussin, Brig. Jen. Dato' Prof. Dr. Khairel Rafezi, Ahmad, Dr. Mohd Arif Anuar, Mohd Salleh Muhammad Hafiz, Hazizi Zainal Arifin, Ahmad, Prof. Dr. Wettability, electrical and mechanical properties of 99.3Sn-0.7Cu/Si 3N4 novel lead-free nanocomposite solder |
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Link to publisher's homepage at www.ttp.net/ |
| author2 |
arifanuar@unimap.edu.my |
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arifanuar@unimap.edu.my Kamarudin, Hussin, Brig. Jen. Dato' Prof. Dr. Khairel Rafezi, Ahmad, Dr. Mohd Arif Anuar, Mohd Salleh Muhammad Hafiz, Hazizi Zainal Arifin, Ahmad, Prof. Dr. |
| format |
Article |
| author |
Kamarudin, Hussin, Brig. Jen. Dato' Prof. Dr. Khairel Rafezi, Ahmad, Dr. Mohd Arif Anuar, Mohd Salleh Muhammad Hafiz, Hazizi Zainal Arifin, Ahmad, Prof. Dr. |
| author_sort |
Kamarudin, Hussin, Brig. Jen. Dato' Prof. Dr. |
| title |
Wettability, electrical and mechanical properties of 99.3Sn-0.7Cu/Si 3N4 novel lead-free nanocomposite solder |
| title_short |
Wettability, electrical and mechanical properties of 99.3Sn-0.7Cu/Si 3N4 novel lead-free nanocomposite solder |
| title_full |
Wettability, electrical and mechanical properties of 99.3Sn-0.7Cu/Si 3N4 novel lead-free nanocomposite solder |
| title_fullStr |
Wettability, electrical and mechanical properties of 99.3Sn-0.7Cu/Si 3N4 novel lead-free nanocomposite solder |
| title_full_unstemmed |
Wettability, electrical and mechanical properties of 99.3Sn-0.7Cu/Si 3N4 novel lead-free nanocomposite solder |
| title_sort |
wettability, electrical and mechanical properties of 99.3sn-0.7cu/si 3n4 novel lead-free nanocomposite solder |
| publisher |
Trans Tech Publications |
| publishDate |
2011 |
| url |
http://dspace.unimap.edu.my/xmlui/handle/123456789/16293 |
| _version_ |
1643791481454985216 |
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13.222552 |