Effect of different copper fillers on the electrical resistivity of conductive adhesives
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Main Authors: | Li-Ngee, Ho, Nishikawa, Hiroshi, Takemoto, Tadashi |
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Other Authors: | holingee@yahoo.com |
Format: | Article |
Language: | English |
Published: |
Springer Science+Business Media, LLC
2011
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Online Access: | http://dspace.unimap.edu.my/xmlui/handle/123456789/14016 |
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