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Intermetallic Compound (IMC) Analysis by Using Isothermal Aging Testing on Lead Free Solder

Conference Venue : UniKL MFI

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Main Authors: L.Chee Ping, Azrina A., Ismail S.A
Format:
Published: 2013
Subjects:
Soldering
Intermetallic Compound (IMC)
Lead Free Solder
Isothermal aging
Online Access:http://ir.unikl.edu.my/jspui/handle/123456789/4826
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spelling my.unikl.ir-48262013-11-26T06:42:15Z Intermetallic Compound (IMC) Analysis by Using Isothermal Aging Testing on Lead Free Solder L.Chee Ping, Azrina A. Ismail S.A Soldering Intermetallic Compound (IMC) Lead Free Solder Isothermal aging Conference Venue : UniKL MFI Lead free solder has been attracting a lot of attention in the recent years due to elimination of the use of lead in the electronic industry. One of the important behaviour of soldering analysis is Intermetallic Compound (IMC) Analysis. This paper focus on IMC analysis for lead free solders. Isothermal aging tests were carried out on the specimens in order to investigate the effects of aging temperature and time on the growth of intermetallic compound of Sn25Ag10Sb (lead-free solder) on Nickel (Ni) Platting Substrate. After reflow, solder joint specimens were put into a thermal oven and isothermally aged at three temperatures of 200, 225 and 250°C for four different time durations of 1, 5, 10 and 15 hours. Samples were analyzed using metallographic techniques with high optical microscope, scanning electron microscopy (SEM), energy dispersive X-ray (EDX). According to EDX analysis, Ni Sn , Ni Sn , Ni Sn and Ni Sn were present in the Intermetallic Compound (IMC) 3 4 3 2 3 4 microstructure. Result for both solders showed that the higher the aging temperature and time, the thicker the IMCs layer grew. Sn25Ag10Sb on Ni interface shows an obvious IMCs layer formed. It was found that the 1/2 formation of IMCs layer was under diffusion-controlled process and its growth can be expressed as X = kt .. The activation energy for the Ni Sn growth in solid state reaction of Sn25Ag10Sb on Ni were estimated to be 3 4 50.733kJ/mol and 42.869kJ/ mol respectively. 2013-11-26T06:42:15Z 2013-11-26T06:42:15Z 2013-11-26 http://ir.unikl.edu.my/jspui/handle/123456789/4826
institution Universiti Kuala Lumpur
building UniKL Library
collection Institutional Repository
continent Asia
country Malaysia
content_provider Universiti Kuala Lumpur
content_source UniKL Institutional Repository
url_provider http://ir.unikl.edu.my/
topic Soldering
Intermetallic Compound (IMC)
Lead Free Solder
Isothermal aging
spellingShingle Soldering
Intermetallic Compound (IMC)
Lead Free Solder
Isothermal aging
L.Chee Ping, Azrina A.
Ismail S.A
Intermetallic Compound (IMC) Analysis by Using Isothermal Aging Testing on Lead Free Solder
description Conference Venue : UniKL MFI
format
author L.Chee Ping, Azrina A.
Ismail S.A
author_facet L.Chee Ping, Azrina A.
Ismail S.A
author_sort L.Chee Ping, Azrina A.
title Intermetallic Compound (IMC) Analysis by Using Isothermal Aging Testing on Lead Free Solder
title_short Intermetallic Compound (IMC) Analysis by Using Isothermal Aging Testing on Lead Free Solder
title_full Intermetallic Compound (IMC) Analysis by Using Isothermal Aging Testing on Lead Free Solder
title_fullStr Intermetallic Compound (IMC) Analysis by Using Isothermal Aging Testing on Lead Free Solder
title_full_unstemmed Intermetallic Compound (IMC) Analysis by Using Isothermal Aging Testing on Lead Free Solder
title_sort intermetallic compound (imc) analysis by using isothermal aging testing on lead free solder
publishDate 2013
url http://ir.unikl.edu.my/jspui/handle/123456789/4826
_version_ 1644484673852669952
score 13.222552

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