Description: Intermetallic Compound (IMC) Analysis by Using Isothermal Aging Testing on Lead Free Solder

Conference Venue : UniKL MFI

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Bibliographic Details
Main Authors:	L.Chee Ping, Azrina A., Ismail S.A
Format:
Published:	2013
Subjects:	Soldering Intermetallic Compound (IMC) Lead Free Solder Isothermal aging
Online Access:	http://ir.unikl.edu.my/jspui/handle/123456789/4826
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Description
Summary:	Conference Venue : UniKL MFI