High-k gate dielectric nano-FET leakage current analysis
This paper reveals the use of high-k dielectric material to mitigate the subthreshold leakage current. The feature size of conventional MOSFET using SiO2 has approached their physical limits where the oxide thickness should not reach below 2nm due to high leakage current and the tunnelling increase...
Saved in:
Main Authors: | , , , , , , |
---|---|
Format: | Proceedings |
Language: | English English |
Published: |
Institute of Electrical and Electronics Engineers
2021
|
Subjects: | |
Online Access: | https://eprints.ums.edu.my/id/eprint/32713/2/High-k%20gate%20dielectric%20nano-FET%20leakage%20current%20analysis.ABSTRACT.pdf https://eprints.ums.edu.my/id/eprint/32713/1/High-k%20Gate%20Dielectric%20Nano-FET%20Leakage%20Current%20Analysis.pdf https://eprints.ums.edu.my/id/eprint/32713/ https://ieeexplore.ieee.org/document/9652730 |
Tags: |
Add Tag
No Tags, Be the first to tag this record!
|
id |
my.ums.eprints.32713 |
---|---|
record_format |
eprints |
spelling |
my.ums.eprints.327132022-06-08T01:24:56Z https://eprints.ums.edu.my/id/eprint/32713/ High-k gate dielectric nano-FET leakage current analysis Bunseng, Chan Charlie Soh Kang, Eng Siew Hui, Seng Kheong Lim, Wei Jer Ismail Saad Nurmin Bolong TA1-2040 Engineering (General). Civil engineering (General) TK1-9971 Electrical engineering. Electronics. Nuclear engineering This paper reveals the use of high-k dielectric material to mitigate the subthreshold leakage current. The feature size of conventional MOSFET using SiO2 has approached their physical limits where the oxide thickness should not reach below 2nm due to high leakage current and the tunnelling increase drastically. Therefore, it is difficult to scale down the size of the MOSFET meanwhile improve its performance. Instead of reducing the size of the transistor, it can make the changes to the parameter, such as the channel length, oxide thickness, and channel width. However, these may affect the performance of the device. Hence, the replacement of SiO2 with other high-k dielectric material has been analyzed. The material used in the analysis including SiO2, Al2O3, HfO2, Ta2O5, and La2O3. The characteristic of subthreshold leakage current was tested through simulation using MATLAB. La2O3 as dielectric material shows a good refinement on mitigating the subthreshold leakage current by 87% compared to SiO2. Institute of Electrical and Electronics Engineers 2021-12-29 Proceedings PeerReviewed text en https://eprints.ums.edu.my/id/eprint/32713/2/High-k%20gate%20dielectric%20nano-FET%20leakage%20current%20analysis.ABSTRACT.pdf text en https://eprints.ums.edu.my/id/eprint/32713/1/High-k%20Gate%20Dielectric%20Nano-FET%20Leakage%20Current%20Analysis.pdf Bunseng, Chan and Charlie Soh and Kang, Eng Siew and Hui, Seng Kheong and Lim, Wei Jer and Ismail Saad and Nurmin Bolong (2021) High-k gate dielectric nano-FET leakage current analysis. https://ieeexplore.ieee.org/document/9652730 |
institution |
Universiti Malaysia Sabah |
building |
UMS Library |
collection |
Institutional Repository |
continent |
Asia |
country |
Malaysia |
content_provider |
Universiti Malaysia Sabah |
content_source |
UMS Institutional Repository |
url_provider |
http://eprints.ums.edu.my/ |
language |
English English |
topic |
TA1-2040 Engineering (General). Civil engineering (General) TK1-9971 Electrical engineering. Electronics. Nuclear engineering |
spellingShingle |
TA1-2040 Engineering (General). Civil engineering (General) TK1-9971 Electrical engineering. Electronics. Nuclear engineering Bunseng, Chan Charlie Soh Kang, Eng Siew Hui, Seng Kheong Lim, Wei Jer Ismail Saad Nurmin Bolong High-k gate dielectric nano-FET leakage current analysis |
description |
This paper reveals the use of high-k dielectric material to mitigate the subthreshold leakage current. The feature size of conventional MOSFET using SiO2 has approached their physical limits where the oxide thickness should not reach below 2nm due to high leakage current and the tunnelling increase drastically. Therefore, it is difficult to scale down the size of the MOSFET meanwhile improve its performance. Instead of reducing the size of the transistor, it can make the changes to the parameter, such as the channel length, oxide thickness, and channel width. However, these may affect the performance of the device. Hence, the replacement of SiO2 with other high-k dielectric material has been analyzed. The material used in the analysis including SiO2, Al2O3, HfO2, Ta2O5, and La2O3. The characteristic of subthreshold leakage current was tested through simulation using MATLAB. La2O3 as dielectric material shows a good refinement on mitigating the subthreshold leakage current by 87% compared to SiO2. |
format |
Proceedings |
author |
Bunseng, Chan Charlie Soh Kang, Eng Siew Hui, Seng Kheong Lim, Wei Jer Ismail Saad Nurmin Bolong |
author_facet |
Bunseng, Chan Charlie Soh Kang, Eng Siew Hui, Seng Kheong Lim, Wei Jer Ismail Saad Nurmin Bolong |
author_sort |
Bunseng, Chan |
title |
High-k gate dielectric nano-FET leakage current analysis |
title_short |
High-k gate dielectric nano-FET leakage current analysis |
title_full |
High-k gate dielectric nano-FET leakage current analysis |
title_fullStr |
High-k gate dielectric nano-FET leakage current analysis |
title_full_unstemmed |
High-k gate dielectric nano-FET leakage current analysis |
title_sort |
high-k gate dielectric nano-fet leakage current analysis |
publisher |
Institute of Electrical and Electronics Engineers |
publishDate |
2021 |
url |
https://eprints.ums.edu.my/id/eprint/32713/2/High-k%20gate%20dielectric%20nano-FET%20leakage%20current%20analysis.ABSTRACT.pdf https://eprints.ums.edu.my/id/eprint/32713/1/High-k%20Gate%20Dielectric%20Nano-FET%20Leakage%20Current%20Analysis.pdf https://eprints.ums.edu.my/id/eprint/32713/ https://ieeexplore.ieee.org/document/9652730 |
_version_ |
1760231063974576128 |
score |
13.160551 |