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Effect of Different Aging Temperatures on Interfacial Reaction between SAC305 and ENEPIG Surface Finish

In electronic packaging industry, they are now driven technology to green product by replacing leaded-solder with lead-free solder in order to fulfill the European Restriction of Hazardous Substance (RoHS) compliance. Thus, Sn-Ag-Cu lead-free solder family is one of candidates can fulfill this re...

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Bibliographic Details
Main Authors:	Siti Rabiatull Aisha, Idris, Saliza Azlina, Osman, Ali, Ourdjini, Azmah Hanim, Mohamad Ariff
Format:	Article
Language:	English
Published:	Trans Tech Publications, Switzerland 2012
Subjects:	T Technology (General) TN Mining engineering. Metallurgy
Online Access:	http://umpir.ump.edu.my/id/eprint/5202/1/AMR_from_kak_ija.pdf http://umpir.ump.edu.my/id/eprint/5202/ http://dx.doi.org/10.4028/www.scientific.net/AMR.415-417.1181
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