Effect of Different Aging Temperatures on Interfacial Reaction between SAC305 and ENEPIG Surface Finish
In electronic packaging industry, they are now driven technology to green product by replacing leaded-solder with lead-free solder in order to fulfill the European Restriction of Hazardous Substance (RoHS) compliance. Thus, Sn-Ag-Cu lead-free solder family is one of candidates can fulfill this re...
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| Main Authors: | , , , |
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| Format: | Article |
| Language: | English |
| Published: |
Trans Tech Publications, Switzerland
2012
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| Subjects: | |
| Online Access: | http://umpir.ump.edu.my/id/eprint/5202/1/AMR_from_kak_ija.pdf http://umpir.ump.edu.my/id/eprint/5202/ http://dx.doi.org/10.4028/www.scientific.net/AMR.415-417.1181 |
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