The comparison between four PLCC packages and eight PLCC packages in personal computer (PC) using computational Fluid Dynamic (CFD), FLUENT TM using epoxy moulding compound material (EMC)

The paper present the three dimensional numerical analysis of heat and fluid flow through Plastic Leaded Chip Carrier (PLCC) packages in inline orientation horizontally mounted on a printed circuit board in a wind tunnel is carried out using a commercial CFD code, FLUENTTM by using Epoxy Moulding Co...

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Bibliographic Details
Main Authors: Mazlan Mohamed, A.Rahim, Muhamad Iqbal Ahmad, Abdullah Mohd Mustafa Al Bakri, Razak Wahab, M.R Mohd Sukhairi
Format: Non-Indexed Article
Published: Trans-Tech Publication 2013
Online Access:http://discol.umk.edu.my/id/eprint/7868/
http://dx.doi.org/10.4028/www.scientific.net/AMR.795.174
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