Thermal fluid-structure interaction in the effects of pin-through-hole diameter during wave soldering
An effective simulation approach is introduced in this paper to study the thermal fluid-structure interaction (thermal FSI) on the effect of pin-through-hole (PTH) diameter on the wave soldering zone. A 3D single PTH connector and a printed circuit board model were constructed to investigate the cap...
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| Main Authors: | , , , , , , |
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| Format: | Indexed Article |
| Published: |
Hindawi Publishing Corporation
2014
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| Online Access: | http://discol.umk.edu.my/id/eprint/7497/ http://www.hindawi.com/journals/ame/2014/275735/ |
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