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Wettability of low silver content lead-free solder alloy

Wettability of low silver (Ag) content Sn-xAg-0.7Cu-0.5In lead-free solder (x = 0.1,0.3,0.5) on copper substrate was investigated. Wetting balance test results indicated that varying small Ag content in the alloy affects the wettability of solders with higher Ag content showing better wettability. T...

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Bibliographic Details
Main Authors: Dharma, I., Budi, Gusti Bagus, Abd Shukor, Mohd Hamdi, Ariga, Tadashi
Format: Article
Published: 2009
Subjects:
TS Manufactures
Online Access:http://eprints.um.edu.my/6937/
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http://eprints.um.edu.my/6937/

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