Effect of porous copper pore density on joint interface: microstructure and mechanical analysis
The effect of the pore density of porous copper (Cu) on brazed Cu/porous Cu was investigated. A filler with a composition of Cu-9.0Sn-7.0Ni-6.0P (Sn: Tin; Ni: Nickel; P: Phosphorus) and porous Cu with pore densities of 15 pores per inch (PPI), 25 PPI, and 50 PPI were employed. The joint strength of...
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| Main Authors: | , , , , , |
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| Format: | Article |
| Published: |
Harbin Institute of Technology
2022
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| Subjects: | |
| Online Access: | http://eprints.um.edu.my/43391/ |
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