Effect of porous copper pore density on joint interface: microstructure and mechanical analysis

• Main Authors: Zahri, Nur Amirah Mohd, Yusof, Farazila, Miyashita, Yukio, Ariga, Tadashi, Abdul, Haseeb, Sukiman, Nazatul Liana
• Format: Article
• Published: Harbin Institute of Technology 2022
• Subjects: TJ Mechanical engineering and machinery
• Online Access: http://eprints.um.edu.my/43391/

The effect of the pore density of porous copper (Cu) on brazed Cu/porous Cu was investigated. A filler with a composition of Cu-9.0Sn-7.0Ni-6.0P (Sn: Tin; Ni: Nickel; P: Phosphorus) and porous Cu with pore densities of 15 pores per inch (PPI), 25 PPI, and 50 PPI were employed. The joint strength of Cu/porous Cu was evaluated with shear tests at different brazing temperatures. Characterizations of the joint interface and fractured surface were achieved with scanning electron microscope (SEM), energy dispersive X-ray spectroscopy (EDX), and X-ray diffraction (XRD). The micro-hardness test of Cu/porous Cu joint interface showed a high hardness value (HV) for 50 PPI porous Cu. This result was in line with its low shear strength. It was proved that the joint strength of Cu/porous Cu is dependent on the pore density of the porous Cu structure and brittle phases of Cu3P and Ni3P in the brazed interface. Copyright and License information: Journal of Harbin Institute of Technology (New Series) 2022