Optimization of KOH etching process for MEMS square diaphragm using response surface method
Potassium hydroxide (KOH) wet etching is widely used in realizing microelectromechanical systems (MEMS) diaphragm due to its low cost, safe and easy handling. However, a variety of etching parameters such as etchant concentration, temperature, mask size and etching time need to be optimized thorough...
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| Main Authors: | , , , , |
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| Format: | Article |
| Published: |
Institute of Advanced Engineering and Science
2019
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| Subjects: | |
| Online Access: | http://eprints.um.edu.my/22950/ https://doi.org/10.11591/ijeecs.v15.i1.pp113-121 |
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