Formation and characterization of intermetallic compounds in electroplated cobalt–tin multilayers
Intermetallic compounds (IMC) form during the metallurgical bonding processes when the interfaces involve solid metal and molten solder. Cobalt (Co) is a promising candidate to be used as under bump metallization (UBM) material, tin (Sn)-based solder alloying element, and transient liquid phase bond...
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| Main Authors: | , , , , |
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| 格式: | Article |
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Springer
2018
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| 主題: | |
| 在線閱讀: | http://eprints.um.edu.my/22009/ https://doi.org/10.1007/s10854-018-8550-1 |
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