Comparative study of interfacial interaction between aromatic and aliphatic functional group in solder wettability
The effect of using different flux on wettability of Sn-Ag-Cu lead free solder were investigated. In this study, solder paste Sn-3.0Ag-0.5Cu (SAC305) was used by introducing two types of no-clean flux with different ingredients. The solders namely as SAC305-A and SAC305-B respectively. Then, the bot...
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my.um.eprints.217822019-08-05T07:16:29Z http://eprints.um.edu.my/21782/ Comparative study of interfacial interaction between aromatic and aliphatic functional group in solder wettability Ismail, Norliza Ismail, Roslina Jalar, Azman Omar, Ghazali Salleh, Emee Marina Kamil, Norinsan Rahman, Irman Abdul N Visual arts (General) For photography, see TR TJ Mechanical engineering and machinery The effect of using different flux on wettability of Sn-Ag-Cu lead free solder were investigated. In this study, solder paste Sn-3.0Ag-0.5Cu (SAC305) was used by introducing two types of no-clean flux with different ingredients. The solders namely as SAC305-A and SAC305-B respectively. Then, the both solder paste manually printed on printed circuit board (PCB) using stencil printing and then reflowed at 260 °C temperature. Wettability of Sn-Ag-Cu solder using different flux was determined by contact angle measurement using Alicona ® IFM software. Results show the SAC305-A solder alloys have a good and better wettability with lower contact angle compared to SAC305-B. Functional groups of both solder flux was identified by FTIR analysis. Meanwhile XPS analysis was performed in characterizing the studied fluxes. It was found that no-clean flux solder with aromatic functional groups showed lower contact angle value and better wettability than aliphatic contained functional groups. Springer 2018 Article PeerReviewed Ismail, Norliza and Ismail, Roslina and Jalar, Azman and Omar, Ghazali and Salleh, Emee Marina and Kamil, Norinsan and Rahman, Irman Abdul (2018) Comparative study of interfacial interaction between aromatic and aliphatic functional group in solder wettability. Journal of Materials Science: Materials in Electronics, 29 (15). pp. 12910-12916. ISSN 0957-4522 https://doi.org/10.1007/s10854-018-9410-8 doi:10.1007/s10854-018-9410-8 |
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N Visual arts (General) For photography, see TR TJ Mechanical engineering and machinery Ismail, Norliza Ismail, Roslina Jalar, Azman Omar, Ghazali Salleh, Emee Marina Kamil, Norinsan Rahman, Irman Abdul Comparative study of interfacial interaction between aromatic and aliphatic functional group in solder wettability |
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The effect of using different flux on wettability of Sn-Ag-Cu lead free solder were investigated. In this study, solder paste Sn-3.0Ag-0.5Cu (SAC305) was used by introducing two types of no-clean flux with different ingredients. The solders namely as SAC305-A and SAC305-B respectively. Then, the both solder paste manually printed on printed circuit board (PCB) using stencil printing and then reflowed at 260 °C temperature. Wettability of Sn-Ag-Cu solder using different flux was determined by contact angle measurement using Alicona ® IFM software. Results show the SAC305-A solder alloys have a good and better wettability with lower contact angle compared to SAC305-B. Functional groups of both solder flux was identified by FTIR analysis. Meanwhile XPS analysis was performed in characterizing the studied fluxes. It was found that no-clean flux solder with aromatic functional groups showed lower contact angle value and better wettability than aliphatic contained functional groups. |
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Ismail, Norliza Ismail, Roslina Jalar, Azman Omar, Ghazali Salleh, Emee Marina Kamil, Norinsan Rahman, Irman Abdul |
author_facet |
Ismail, Norliza Ismail, Roslina Jalar, Azman Omar, Ghazali Salleh, Emee Marina Kamil, Norinsan Rahman, Irman Abdul |
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Ismail, Norliza |
title |
Comparative study of interfacial interaction between aromatic and aliphatic functional group in solder wettability |
title_short |
Comparative study of interfacial interaction between aromatic and aliphatic functional group in solder wettability |
title_full |
Comparative study of interfacial interaction between aromatic and aliphatic functional group in solder wettability |
title_fullStr |
Comparative study of interfacial interaction between aromatic and aliphatic functional group in solder wettability |
title_full_unstemmed |
Comparative study of interfacial interaction between aromatic and aliphatic functional group in solder wettability |
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comparative study of interfacial interaction between aromatic and aliphatic functional group in solder wettability |
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2018 |
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http://eprints.um.edu.my/21782/ https://doi.org/10.1007/s10854-018-9410-8 |
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