Structural failure analysis of polycarbonate enclosures of electronic devices subjected to multiple ball impacts

• Main Authors: Yau, Yat Huang, Hua, Shijie Norman, Kok, Chee Kuang
• Format: Article
• Published: Elsevier 2018
• Subjects: TJ Mechanical engineering and machinery
• Online Access: http://eprints.um.edu.my/20292/; https://doi.org/10.1016/j.polymertesting.2017.12.013

The present study predicts the structural damage on polycarbonate enclosures of electronic devices in multiple ball impact tests, achieved through numerical simulation and experiments. A novel methodology in modelling repeated ball impacts was established and proven. It was found that the finite ele...