Kesan penuaan sesuhu terhadap sifat mikro kekerasan pempaterian Sn-Ag-Cu/cnt/cu menggunakan pelekukan nano (Effect of isothermal aging on microhardness properties of Sn-Ag-Cu/CNT/Cu using nanoindentation)
Effect of thermal aging towards hardness properties of Sn-3.0Ag-0.5Cu (SAC305) solder joint added with carbon nanotube (CNT) particles was investigated. Hardness properties indicate the strength of solder was determined by nanoindentation approach. SAC solder alloy was added with 0.03% weight percen...
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| Main Authors: | , , , , , , |
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| Format: | Article |
| Published: |
Penerbit Universiti Kebangsaan Malaysia
2019
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| Subjects: | |
| Online Access: | http://eprints.um.edu.my/19949/ https://doi.org/10.17576/jsm-2019-4806-14 |
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