Mechanical properties of intermetallic compounds in electrodeposited multilayered thin film at small scale by nanoindentation

• Main Authors: Rahman, A.M.S., Chia, P.Y., Haseeb, A.S. Md. Abdul
• Format: Article
• Language: English
• Published: Materials Letters 2015
• Subjects: T Technology (General); TJ Mechanical engineering and machinery
• Online Access: http://eprints.um.edu.my/13757/1/Mechanical_properties_of_intermetallic_compounds_in.pdf; http://eprints.um.edu.my/13757/; http://www.sciencedirect.com/science/article/pii/S0167577X15001408

Mechanical properties of intermetallic compounds (IMCs) which were formed in electrodeposited Cu/Sn and Cu/Ni/Sn multilayered thin film have been investigated. The layers of Cu, Sn and Ni were formed by electrodeposition technique using copper pyrophosphate, tin methanesulfonic and nickel Watts bath...