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Heat transfer in switch / Muhamad Asraf Mohd

Most of the electronic system failures are because of thermal reasons. Therefore, the possibility of accurate prediction of device temperature is crucial for its design and modeling. The purpose of this project is to study the effect of heat transfer in a switch when Beryllium Copper is used as the...

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Main Author: Mohd, Muhamad Asraf
Format: Thesis
Language:English
Published: 2017
Subjects:
TK Electrical engineering. Electronics. Nuclear engineering
Online Access:https://ir.uitm.edu.my/id/eprint/98483/1/98483.pdf
https://ir.uitm.edu.my/id/eprint/98483/
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id my.uitm.ir.98483
record_format eprints
spelling my.uitm.ir.984832024-07-28T16:06:57Z https://ir.uitm.edu.my/id/eprint/98483/ Heat transfer in switch / Muhamad Asraf Mohd Mohd, Muhamad Asraf TK Electrical engineering. Electronics. Nuclear engineering Most of the electronic system failures are because of thermal reasons. Therefore, the possibility of accurate prediction of device temperature is crucial for its design and modeling. The purpose of this project is to study the effect of heat transfer in a switch when Beryllium Copper is used as the base material and aluminum is used to be the connector of the switch when being supplied by 1.6 a by using same value of parameter of the switch and different value of parameter of the switch. 2017 Thesis NonPeerReviewed text en https://ir.uitm.edu.my/id/eprint/98483/1/98483.pdf Heat transfer in switch / Muhamad Asraf Mohd. (2017) Degree thesis, thesis, Universiti Teknologi MARA (UiTM).
institution Universiti Teknologi Mara
building Tun Abdul Razak Library
collection Institutional Repository
continent Asia
country Malaysia
content_provider Universiti Teknologi Mara
content_source UiTM Institutional Repository
url_provider http://ir.uitm.edu.my/
language English
topic TK Electrical engineering. Electronics. Nuclear engineering
spellingShingle TK Electrical engineering. Electronics. Nuclear engineering
Mohd, Muhamad Asraf
Heat transfer in switch / Muhamad Asraf Mohd
description Most of the electronic system failures are because of thermal reasons. Therefore, the possibility of accurate prediction of device temperature is crucial for its design and modeling. The purpose of this project is to study the effect of heat transfer in a switch when Beryllium Copper is used as the base material and aluminum is used to be the connector of the switch when being supplied by 1.6 a by using same value of parameter of the switch and different value of parameter of the switch.
format Thesis
author Mohd, Muhamad Asraf
author_facet Mohd, Muhamad Asraf
author_sort Mohd, Muhamad Asraf
title Heat transfer in switch / Muhamad Asraf Mohd
title_short Heat transfer in switch / Muhamad Asraf Mohd
title_full Heat transfer in switch / Muhamad Asraf Mohd
title_fullStr Heat transfer in switch / Muhamad Asraf Mohd
title_full_unstemmed Heat transfer in switch / Muhamad Asraf Mohd
title_sort heat transfer in switch / muhamad asraf mohd
publishDate 2017
url https://ir.uitm.edu.my/id/eprint/98483/1/98483.pdf
https://ir.uitm.edu.my/id/eprint/98483/
_version_ 1806422112543440896
score 13.211869

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