Heat transfer in switch / Muhamad Asraf Mohd
Most of the electronic system failures are because of thermal reasons. Therefore, the possibility of accurate prediction of device temperature is crucial for its design and modeling. The purpose of this project is to study the effect of heat transfer in a switch when Beryllium Copper is used as the...
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| Format: | Thesis |
| Language: | English |
| Published: |
2017
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| Subjects: | |
| Online Access: | https://ir.uitm.edu.my/id/eprint/98483/1/98483.pdf https://ir.uitm.edu.my/id/eprint/98483/ |
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| Summary: | Most of the electronic system failures are because of thermal reasons. Therefore, the possibility of accurate prediction of device temperature is crucial for its design and modeling. The purpose of this project is to study the effect of heat transfer in a switch when Beryllium Copper is used as the base material and aluminum is used to be the connector of the switch when being supplied by 1.6 a by using same value of parameter of the switch and different value of parameter of the switch. |
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