Development of low normal force contact using electro fine forming and lithography technology

This new technology is realized by Photo Resist Lithography and NiCo Electro Fine Forming Process, and enables the design of a small contact spring for applications requiring high density, high speed and high durability. The evaluation result proved the capability of Low Normal Force (0.10N-0.15N at...

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Main Authors: Bhuiyan, Moinul, Yamada, Shinji, Kurokawa, Noriharu, Sakamoto, Katsuhiko, Takemasa, Eiichiro
Format: Conference or Workshop Item
Language:English
English
Published: 2008
Subjects:
Online Access:http://irep.iium.edu.my/33190/1/Development_of_Low_Normal_Force_Contact_Using_Electro_Fine_Forming_and_Lithography_Technology.pdf
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spelling my.iium.irep.331902013-12-20T07:34:23Z http://irep.iium.edu.my/33190/ Development of low normal force contact using electro fine forming and lithography technology Bhuiyan, Moinul Yamada, Shinji Kurokawa, Noriharu Sakamoto, Katsuhiko Takemasa, Eiichiro TA401 Materials of engineering and construction This new technology is realized by Photo Resist Lithography and NiCo Electro Fine Forming Process, and enables the design of a small contact spring for applications requiring high density, high speed and high durability. The evaluation result proved the capability of Low Normal Force (0.10N-0.15N at 0.3mm) at contact point (5μm radius), durability of 100,000 contact cycles (less than 50mΩ). 2008-10 Conference or Workshop Item REM application/pdf en http://irep.iium.edu.my/33190/1/Development_of_Low_Normal_Force_Contact_Using_Electro_Fine_Forming_and_Lithography_Technology.pdf application/pdf en http://irep.iium.edu.my/33190/4/TE_Technical_Conference_2008.jpg Bhuiyan, Moinul and Yamada, Shinji and Kurokawa, Noriharu and Sakamoto, Katsuhiko and Takemasa, Eiichiro (2008) Development of low normal force contact using electro fine forming and lithography technology. In: Tyco Electronics Technical Conference 2008, 14-16 Oct 2008, Shanghai, China. (Unpublished) http://www.te.com/en/home.html
institution Universiti Islam Antarabangsa Malaysia
building IIUM Library
collection Institutional Repository
continent Asia
country Malaysia
content_provider International Islamic University Malaysia
content_source IIUM Repository (IREP)
url_provider http://irep.iium.edu.my/
language English
English
topic TA401 Materials of engineering and construction
spellingShingle TA401 Materials of engineering and construction
Bhuiyan, Moinul
Yamada, Shinji
Kurokawa, Noriharu
Sakamoto, Katsuhiko
Takemasa, Eiichiro
Development of low normal force contact using electro fine forming and lithography technology
description This new technology is realized by Photo Resist Lithography and NiCo Electro Fine Forming Process, and enables the design of a small contact spring for applications requiring high density, high speed and high durability. The evaluation result proved the capability of Low Normal Force (0.10N-0.15N at 0.3mm) at contact point (5μm radius), durability of 100,000 contact cycles (less than 50mΩ).
format Conference or Workshop Item
author Bhuiyan, Moinul
Yamada, Shinji
Kurokawa, Noriharu
Sakamoto, Katsuhiko
Takemasa, Eiichiro
author_facet Bhuiyan, Moinul
Yamada, Shinji
Kurokawa, Noriharu
Sakamoto, Katsuhiko
Takemasa, Eiichiro
author_sort Bhuiyan, Moinul
title Development of low normal force contact using electro fine forming and lithography technology
title_short Development of low normal force contact using electro fine forming and lithography technology
title_full Development of low normal force contact using electro fine forming and lithography technology
title_fullStr Development of low normal force contact using electro fine forming and lithography technology
title_full_unstemmed Development of low normal force contact using electro fine forming and lithography technology
title_sort development of low normal force contact using electro fine forming and lithography technology
publishDate 2008
url http://irep.iium.edu.my/33190/1/Development_of_Low_Normal_Force_Contact_Using_Electro_Fine_Forming_and_Lithography_Technology.pdf
http://irep.iium.edu.my/33190/4/TE_Technical_Conference_2008.jpg
http://irep.iium.edu.my/33190/
http://www.te.com/en/home.html
_version_ 1643610384804872192
score 13.212271