Thermal Analysis of Semiconductor: Peak Junction Temperature Prediction

• Main Author: Hussin, Nur Ain Nabilah
• Format: Final Year Project
• Language: English
• Published: Universiti Teknologi PETRONAS 2016
• Subjects: TK Electrical engineering. Electronics Nuclear engineering
• Online Access: http://utpedia.utp.edu.my/22566/1/FinalDissertation.pdf; http://utpedia.utp.edu.my/22566/

Semiconductor industries become really important towards today’s technology. Integrated Circuit (IC) are produced to meet the demand since there are lots of modern devices nowadays rely on this semiconductor devices. Due to this scenario, most ICs are designed to operate with high power dissipation and speed together with greater packaging density. This features will lead to the increasing of operating temperature as well as decrease the reliability and performance of the system. Besides, the performance of the devices also might be degrade or even fail to function properly. Therefore to overcome this problem, thermal analysis need to be carried out in order to determine the thermal profile of the system and to predict the peak junction temperature. So that, an appropriate cooling strategy and temperature monitoring system can be implemented to provide a controlled temperature surface to an electronic component.