Implementation of Arithmetic Mean Method on Determination of Peak Junction Temperature of Semiconductor Device on Printed Circuit Board
High reliability users of microelectronic devices have been derating junction temperature and other critical stress parameters to improve device reliability and extend operating life. The junction temperature is what really matters for component functionality and reliability. This study presents a u...
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| Format: | Final Year Project |
| Language: | English English |
| Published: |
Universiti Teknologi Petronas
2013
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| Online Access: | http://utpedia.utp.edu.my/13467/1/guwanch.pdf http://utpedia.utp.edu.my/13467/2/guwanch.pdf http://utpedia.utp.edu.my/13467/ |
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