Nanoindentation approach on investigating micromechanical properties of joining from green solder materials

• Main Authors: Maria Abu Bakar,, Azman Jalar,, Abdul Razak Daud,, Roslina Ismail,, Nur Azida Che Lah,, Najib Saedi Ibrahim,
• Format: Article
• Language: English
• Published: Penerbit Universiti Kebangsaan Malaysia 2016
• Online Access: http://journalarticle.ukm.my/10187/1/14%20Maria%20Abu%20Bakar.pdf; http://journalarticle.ukm.my/10187/; http://www.ukm.my/jsm/english_journals/vol45num8_2016/contentsVol45num8_2016.html

This work investigates the micromechanical properties of Sn96.5Ag3.0Cu (SAC 305) on Immersion Tin (ImSn) surface finished after subjected to high temperature storage (HTS) at 180°C for 200 to 1000 h period. Nanoindentation approach was used to measure the micromechanical properties of the solder. It was observed that the indentation depth and plastic depth were increased and a clear trend of decreasing hardness as opposed to the increasing reduced modulus as the HTS time lengthened. The plasticity-asscociated properties become stronger meanwhile the elasticity-associated properties decreased with the HTS time. These findings indicate that nanoindentation approach can clearly determine the plastic and elastic deformation occurance throughout the test.