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CFD modelling of heat sinks thermal boundary layer effect on cooling of electronic components.

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Bibliographic Details
Main Author: Mohd Hanif, Muhammad Zharif Mifdhal
Format: Final Year Project
Published: 2024
Subjects:
TJ Mechanical engineering and machinery
Online Access:http://utpedia.utp.edu.my/id/eprint/28822/
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id oai:utpedia.utp.edu.my:28822
record_format eprints
spelling oai:utpedia.utp.edu.my:288222024-08-19T02:25:47Z http://utpedia.utp.edu.my/id/eprint/28822/ CFD modelling of heat sinks thermal boundary layer effect on cooling of electronic components. Mohd Hanif, Muhammad Zharif Mifdhal TJ Mechanical engineering and machinery 2024-01 Final Year Project NonPeerReviewed Mohd Hanif, Muhammad Zharif Mifdhal (2024) CFD modelling of heat sinks thermal boundary layer effect on cooling of electronic components. [Final Year Project] (Submitted)
institution Universiti Teknologi Petronas
building UTP Resource Centre
collection Institutional Repository
continent Asia
country Malaysia
content_provider Universiti Teknologi Petronas
content_source UTP Electronic and Digitized Intellectual Asset
url_provider http://utpedia.utp.edu.my/
topic TJ Mechanical engineering and machinery
spellingShingle TJ Mechanical engineering and machinery
Mohd Hanif, Muhammad Zharif Mifdhal
CFD modelling of heat sinks thermal boundary layer effect on cooling of electronic components.
format Final Year Project
author Mohd Hanif, Muhammad Zharif Mifdhal
author_facet Mohd Hanif, Muhammad Zharif Mifdhal
author_sort Mohd Hanif, Muhammad Zharif Mifdhal
title CFD modelling of heat sinks thermal boundary layer effect on cooling of electronic components.
title_short CFD modelling of heat sinks thermal boundary layer effect on cooling of electronic components.
title_full CFD modelling of heat sinks thermal boundary layer effect on cooling of electronic components.
title_fullStr CFD modelling of heat sinks thermal boundary layer effect on cooling of electronic components.
title_full_unstemmed CFD modelling of heat sinks thermal boundary layer effect on cooling of electronic components.
title_sort cfd modelling of heat sinks thermal boundary layer effect on cooling of electronic components.
publishDate 2024
url http://utpedia.utp.edu.my/id/eprint/28822/
_version_ 1808972444122218496
score 13.2014675

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