Thermal Analysis of VLSI System using Successive Over Relaxation (SOR) Method

• Main Authors: Aruchunan, E., Siri, Z., Naganthran, K., Aziz, M.H.B.N., Ghazali, S.A., Muthuvalu, M.S., Sulaiman, J.
• Format: Article
• Published: Springer Science and Business Media Deutschland GmbH 2022
• Online Access: http://scholars.utp.edu.my/id/eprint/34091/; https://www.scopus.com/inward/record.uri?eid=2-s2.0-85140226006&doi=10.1007%2f978-3-031-04028-3_14&partnerID=40&md5=36611fb86c6b9bf2e9d75069a22dbcf8

Nowadays, as the size of Very large scale integration (VLSI) is getting smaller, thermal effects are playing an important role in the system since the high temperature can affect the performance of the system. There is a various of method in determining the thermal profile of VLSI system. The focus...