Design and development of a modular valveless micropump on a printed circuit board for integrated electronic cooling

With constraints on size, cost, reliability, and performance for liquid-based cooling systems, the design of modular micropumps suitable for an integrated thermal management system still remains a challenge. In this paper, the effectiveness of a low-cost valveless micropump-heat exchanger on a print...

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Bibliographic Details
Main Authors: T., Nagarajan, P., Verma, D., Chatterjee
Format: Citation Index Journal
Published: 2009
Subjects:
Online Access:http://eprints.utp.edu.my/279/1/paper.pdf
http://www.scopus.com/inward/record.url?eid=2-s2.0-64549162388&partnerID=40&md5=6b3a42b63f2c9665cebf28094974b410
http://eprints.utp.edu.my/279/
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