Analytical hierarchy process application of body in white modular sub-assembly for automotive manufacturing in Malaysia - A case study
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| Main Authors: | , , , |
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| Format: | Conference or Workshop Item |
| Published: |
Institute of Physics Publishing
2019
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| Online Access: | https://www.scopus.com/inward/record.uri?eid=2-s2.0-85060975806&doi=10.1088%2f1757-899X%2f469%2f1%2f012004&partnerID=40&md5=7a8fbcb8e740d189d513b9325cd0af9e http://eprints.utp.edu.my/25153/ |
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