Phase change material/heat pipe and Copper foam-based heat sinks for thermal management of electronic systems

Phase change material (PCM) has been extensively used for their thermal management but due to low conductivity that hinders the performance of a system. Since heat pipe and porous materials both have high thermal conductivities, they can be used to form hybrid system with PCM which significantly enh...

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Bibliographic Details
Main Authors: Hayat, M.A., Ali, H.M., Janjua, M.M., Pao, W., Li, C., Alizadeh, M.
Format: Article
Published: Elsevier Ltd 2020
Online Access:https://www.scopus.com/inward/record.uri?eid=2-s2.0-85092713427&doi=10.1016%2fj.est.2020.101971&partnerID=40&md5=7e65ca449b72e228ee7e8552f302d6f7
http://eprints.utp.edu.my/23433/
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