Analysis of Bonding Failure in CMOS MEMS Chips
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| Online Access: | http://eprints.utp.edu.my/10224/ |
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my.utp.eprints.102242013-10-25T01:56:59Z Analysis of Bonding Failure in CMOS MEMS Chips Citation Index Journal NonPeerReviewed UNSPECIFIED Analysis of Bonding Failure in CMOS MEMS Chips. [Citation Index Journal] http://eprints.utp.edu.my/10224/ |
| institution |
Universiti Teknologi Petronas |
| building |
UTP Resource Centre |
| collection |
Institutional Repository |
| continent |
Asia |
| country |
Malaysia |
| content_provider |
Universiti Teknologi Petronas |
| content_source |
UTP Institutional Repository |
| url_provider |
http://eprints.utp.edu.my/ |
| format |
Citation Index Journal |
| title |
Analysis of Bonding Failure in CMOS MEMS Chips
|
| spellingShingle |
Analysis of Bonding Failure in CMOS MEMS Chips
|
| title_short |
Analysis of Bonding Failure in CMOS MEMS Chips
|
| title_full |
Analysis of Bonding Failure in CMOS MEMS Chips
|
| title_fullStr |
Analysis of Bonding Failure in CMOS MEMS Chips
|
| title_full_unstemmed |
Analysis of Bonding Failure in CMOS MEMS Chips
|
| title_sort |
analysis of bonding failure in cmos mems chips |
| url |
http://eprints.utp.edu.my/10224/ |
| _version_ |
1738655825970331648 |
| score |
13.214268 |