Numerical studies of fluid flow and heat transfer in microchannel heat sink with trapezoidal cavities, ribs and secondary channel
In order to improve reliability and prevent premature failure, heat produced by electronic devices must be transfer efficiently. The microchannel heat sink appears to be the most reliable cooling technology to improve heat transfer performance. A new Microchannel Heat Sink (MCHS) design has been pro...
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Main Authors: | , , |
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Format: | Conference or Workshop Item |
Language: | English |
Published: |
2021
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Subjects: | |
Online Access: | http://eprints.utm.my/id/eprint/98169/1/NorAzwadi2021_NumericalStudiesOfFluidFlowAndHeat.pdf http://eprints.utm.my/id/eprint/98169/ http://dx.doi.org/10.1088/1742-6596/2053/1/012022 |
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Summary: | In order to improve reliability and prevent premature failure, heat produced by electronic devices must be transfer efficiently. The microchannel heat sink appears to be the most reliable cooling technology to improve heat transfer performance. A new Microchannel Heat Sink (MCHS) design has been proposed with trapezoidal cavities, ribs and secondary channels. Fluid flow and heat transfer characteristics for Reynold numbers from 100 to 500 are numerically studied and analysed. Four microchannel heat sinks with various related geometry have been considered in this study, for instance, microchannel with rectangular ribs (TRAC-RR) and microchannel with trapezoidal cavities (TRAC). The finite volume method (FVM) is used to solve the governing equations, and the computations are performed using the SIMPLE algorithm. The present design's overall performance is evaluated using the friction factor, the Nusselt number, and performance evaluation criteria (PEC). The results show that the TRAC-RR-SC MCHS is the best design for the proposed design compared to the other four geometries, with a maximum PEC of 1.78. Additionally, the secondary flow field analyses visually show the hydraulic and thermal performance enhancements due to interruption, flow mixing and redevelopment of the thermal boundary layer. |
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