Ultrasonic B-scan of adhesive bonded thin aluminum sheet

• Main Authors: Mhd Subre, Azim Fikri, Rohani, Md. Supar
• Format: Conference or Workshop Item
• Published: 2017
• Subjects: QC Physics
• Online Access: http://eprints.utm.my/id/eprint/97345/; http://dx.doi.org/10.4028/www.scientific.net/SSP.268.407

Ultrasonic inspection using b-scan (brightness scan) and its application for discontinuity and flaws detection were investigated. Brightness scan is one of the ultrasonic technique’s branches, it provides thorough image of the material which undergone inspection via density of the material where then depicted in different colour in conjunction with the acoustic impedance of the phase gone through by the sound wave. The sound wave generated with a piezoelectric transducer was propagated through aluminum wafer samples and were identified by the b-scan system. Its ability to detect flaw at certain depth which was introduced manually been examined. Experimental results show different brightness characteristic, depending on the adhesive treatments, type of material and medium when the waves pass through in each sample. Brightness scan system was proven to be reliable non-destructive testing method in ultrasonic for inspection of structural bonded materials.