Modification of an electroplated nickel interlayer surface by annealing heat treatment for diamond deposition on tungsten carbide
The tungsten carbide (WC-6%Co) substrate was coated with a nickel layer using the electrochemical deposition process to suppress cobalt diffusion during diamond deposition. However, the high solubility of nickel for carbon is a major issue, which hinders diamond nucleation and growth. Annealing heat...
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Main Authors: | , , , |
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Format: | Article |
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Springer New York LLC
2019
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Online Access: | http://eprints.utm.my/id/eprint/90237/ http://dx.doi.org/10.1007/s13632-018-0512-8 |
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