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On Temperature Jump Condition for Slip Flow in a Microchannel With Constant Wall Temperature

The analytical solution in the fully developed region of a slip flow in a circular microtube with constant wall temperature is obtained to verify the conventional temperature jump boundary condition when both viscous dissipation (VD) and substantial derivative of pressure (SDP) terms are included in...

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Main Authors: Asako, Y., Hong, C.
Format: Article
Published: American Society of Mechanical Engineers (ASME) 2017
Subjects:
T Technology (General)
Online Access:http://eprints.utm.my/id/eprint/80716/
http://dx.doi.org/10.1115/1.4036076
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spelling my.utm.807162019-06-27T06:20:41Z http://eprints.utm.my/id/eprint/80716/ On Temperature Jump Condition for Slip Flow in a Microchannel With Constant Wall Temperature Asako, Y. Hong, C. T Technology (General) The analytical solution in the fully developed region of a slip flow in a circular microtube with constant wall temperature is obtained to verify the conventional temperature jump boundary condition when both viscous dissipation (VD) and substantial derivative of pressure (SDP) terms are included in the energy equation. Although the shear work term is not included in the conventional temperature jump boundary condition explicitly, it is verified that the conventional temperature jump boundary condition is valid for a slip flow in a microchannel with constant wall temperature when both viscous dissipation and substantial derivative of pressure terms are included in the energy equation. Numerical results are also obtained for a slip flow in a developing region of a circular tube. The results showed that the maximum heat transfer rate decreases with increasing Mach number. American Society of Mechanical Engineers (ASME) 2017 Article PeerReviewed Asako, Y. and Hong, C. (2017) On Temperature Jump Condition for Slip Flow in a Microchannel With Constant Wall Temperature. Journal of Heat Transfer, 139 (7). ISSN 0022-1481 http://dx.doi.org/10.1115/1.4036076 DOI:10.1115/1.4036076
institution Universiti Teknologi Malaysia
building UTM Library
collection Institutional Repository
continent Asia
country Malaysia
content_provider Universiti Teknologi Malaysia
content_source UTM Institutional Repository
url_provider http://eprints.utm.my/
topic T Technology (General)
spellingShingle T Technology (General)
Asako, Y.
Hong, C.
On Temperature Jump Condition for Slip Flow in a Microchannel With Constant Wall Temperature
description The analytical solution in the fully developed region of a slip flow in a circular microtube with constant wall temperature is obtained to verify the conventional temperature jump boundary condition when both viscous dissipation (VD) and substantial derivative of pressure (SDP) terms are included in the energy equation. Although the shear work term is not included in the conventional temperature jump boundary condition explicitly, it is verified that the conventional temperature jump boundary condition is valid for a slip flow in a microchannel with constant wall temperature when both viscous dissipation and substantial derivative of pressure terms are included in the energy equation. Numerical results are also obtained for a slip flow in a developing region of a circular tube. The results showed that the maximum heat transfer rate decreases with increasing Mach number.
format Article
author Asako, Y.
Hong, C.
author_facet Asako, Y.
Hong, C.
author_sort Asako, Y.
title On Temperature Jump Condition for Slip Flow in a Microchannel With Constant Wall Temperature
title_short On Temperature Jump Condition for Slip Flow in a Microchannel With Constant Wall Temperature
title_full On Temperature Jump Condition for Slip Flow in a Microchannel With Constant Wall Temperature
title_fullStr On Temperature Jump Condition for Slip Flow in a Microchannel With Constant Wall Temperature
title_full_unstemmed On Temperature Jump Condition for Slip Flow in a Microchannel With Constant Wall Temperature
title_sort on temperature jump condition for slip flow in a microchannel with constant wall temperature
publisher American Society of Mechanical Engineers (ASME)
publishDate 2017
url http://eprints.utm.my/id/eprint/80716/
http://dx.doi.org/10.1115/1.4036076
_version_ 1643658495112773632
score 13.211869

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