Improvement of electronic components arrangement on printed circuit board based on thermal distribution profile using comsol multiphysics

• Main Author: Ab. Majid, Nurul Kausar
• Format: Thesis
• Language: English
• Published: 2018
• Subjects: TK Electrical engineering. Electronics Nuclear engineering
• Online Access: http://eprints.utm.my/id/eprint/78958/1/NurulKausarAbMajidMFKE2018.pdf; http://eprints.utm.my/id/eprint/78958/; http://dms.library.utm.my:8080/vital/access/manager/Repository/vital:109666

The increasing demand for high speed, high performance, robust and smaller packaging and high-power density leads to the need for an optimal electronic system design. These features will increase the thermal distribution of electronics components, which directly affect the lifespan of the electronic...